A heat dissipation device includes a heat pipe, a first fin unit, a second fin unit, and a centrifugal fan arranged on the first fin unit for drawing air from the first fin unit to the second fin unit. The device includes third wirings, and a first and a second memory. The substrate includes a first surface and a second surface, wherein the first surface is opposite to the second surface. The anvil assembly is secured between the upper arm and the inwardly directed projection and the cartridge assembly is secured between the lower arm of the inwardly directed projection.