An electroplating system and process makes electrical current density across a semiconductor device substrate surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. Processing of received measurement signals can occur, and the measurement casing has connecting means, for placing in position and releasable attachment of the measurement casing on the structural component, and the contacting means of the measurement casing can establish contact with the measurement sensor for the reception of the measurement signals. The base serves to cradle a remote control, which is used to turn power onoff to the extensions on the cord. First numerical scores indicating that the unrecognized identifiers were provided in place of one or more expected identifiers may be calculated. S-vol Disable does not permit pair forming for duplication of a logical device with another device as the destination of copying.