In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800\xb0 C. Those methods may include forming a sourcedrain region in an NMOS portion of a substrate, wherein the sourcedrain region of the NMOS portion comprises at least one dislocation, and wherein a PMOS sourcedrain region in a PMOS portion of the substrate does not comprise a dislocation. The system includes a user definable depth dimension for the mask surface functions and the integrated mask surface functions and dimension parameter for the mask surfaces are compiled to simulate a modeled air bearing structure for performance analysis and evaluation. At least one torque-transmitting connecting element is located between the basic element and the cam element. At least one processor is communicatively coupled with the at least one display device, the at least one input device, and the at least one reward dispenser. The configuration of the internal wall andor the flow rates may be automatically adjusted by the controller andor manually manipulated to further optimize the fluid flow.