A module device of stacked semiconductor packages and a method for fabricating the module device are proposed, wherein a first semiconductor package provided, and at least a second semiconductor package is stacked on and electrically connected to the first semiconductor package. The lifter body has a first end configured for engaging a cam of an engine and at least one annular pin chamber. Preferably, the optical assembly rotates about an axis, allowing the sensing apparatus to sense results from plural locations on a sample without moving the sample. A tailgate at least partially covers the baggage space and has an open position and a closed position. The annular chamber may be pressurized through a port in the BOP, which may actuate a coiled tubing connector.