The present invention is directed to a multi-product container and container blank. The semiconductor layer defines an X-Y-plane and has a thickness extending in Z-direction. The die attach pad further includes a die attach stop between the die attach region and the at least one substrate ground pad region. The first packet may be processed from the buffer without communication with the host machine. Therefore, the computer includes a circuit that, in response a wake event on the signal line that is not recognized by the motherboard, delivers a wake signal over the signal line that is recognized by the motherboard.