A method for opening a conformal layer at the bottom of a contact via on a substrate is described. The power electronic device may include a housing, a conductive element positioned within the housing and rated for at least a medium voltage, a cooling system in fluid communication with the conductive element, a plurality of temperature sensing tags and a data collection unit having a receiver that is configured to receive signals from the antennae of the temperature sensing tags. In addition, the binding element may be configured to, when the cable assembly is pushed through a conduit having at least one sweep, eliminate buckling of the cable assembly.