A method of PECVD deposition of silicon-containing films has been discovered and further developed. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. The murmur frame is subdivided into sub-areas each dedicated to a specific aspect of the meeting. The DLC films have a construction where carbon atoms are bonded into an SP3 bond in terms of a short-distance order, although the films have an amorphous construction from a macroscopic viewpoint. Thereby, the catalyst is capable of reducing the CO concentration and increasing the H2 concentration in an exhaust gas even after durability at high temperature.