A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test for performing electrical testing. The module includes a storage element for storing an identifier address, used to identify the origin of a packet of data. The determination of the preceding wafer is based on processing results of an upstream process among the plurality of processes performed for the plurality of semiconductor wafers prior to the given process. The tapered or frusta-conical section is sized and configured to guide a second drill rod into the cylindrical section and into alignment with the first drill rod. A sidewall face of the adhesive layer, the reflective layer, and the barrier layer is totally covered by an insulating film, and deposition failure or holes of the insulating film is prevented. In the securing section, the extension arm extends parallel to the longitudinal axis with a constant external cross-sectional shape deviating from a circular shape.