The present invention provides a semiconductor device manufacturing line for applying a series of processes on a semiconductor substrate, and forming an integrated circuit on the semiconductor substrate by employing a semiconductor wafer having a diameter of 6 inches or less for the semiconductor substrate. Each chain link has opposing straps with inside and outside lateral surfaces as well as narrow surfaces perpendicular to the lateral surfaces and essentially parallel to the longitudinal direction of the chain. The new variety is a Peperomia, typically used as an ornamental plant. A transmission mechanism is coupled to the actuator guide and configured to convert the linear motion of the actuator guide into a rotational movement when the switch actuator plate is depressed. A path-based expression may be evaluated in the context of the reference address of the LOB. A sliding part of each movable platen guide on which at least the movable platen slides is given in the form of a ball spline shaft.