An enterprise test system for synthesizing complex objects to exercise an application under test. The occurrence of solder bridges between the terminal electrodes during solder mounting and the occurrence of chipping in the terminal-electrode-forming areas between the recesses on the lengthwise sidewall are both reduced by making the width of the recesses along the lengthwise sidewall either 0. The number of stem cells remaining after stress were increased, and showed increased expression of traditional stem cell markers.