The invention provides a new dual-sided Moir\xe9 wafer analysis system that integrates wafer flatness measurement capability with wafer surface defect detection capability. The registration request further includes an extension field. A film consisting of a first layer of an amorphous polyester such as APET for heat sealing to the PETG, a second layer of a polyester such as PET, and an adhesive layer is used to laminate a graphical paper based cover thereby allowing the laminated cover to be heat sealed to the blister portion. As a result, the Roberval’s parts 4, 5 are not affected by stress strain, which is caused in the process of connecting, even if a size of an electronic balance in a longitudinal direction is not extended. The cooled high pressure air is further transferred to an air-liquid separating tank.