A method for fabricating metal wirings of a semiconductor including forming an etch stop layer on a semiconductor substrate, and forming an inter metal dielectric on the etch stop layer. An invisible tear seam in the panel follows a closed path that is spaced away from a peripheral edge of the panel. The body can also include a filler material made of a superabrasive material. The at least one device management command is transmitted to the managed device. The first and second cavities may be fluidly isolated from each other and may supply fuel and air, respectively, to an exit aperture disposed downstream of the fuel discharge aperture and the air discharge aperture.