A low resistance copper damascene interconnect structure is formed by providing a thin dielectric film such as SiC or SiOC formed on the sidewalls of the via and trench structures to function as a copper diffusion barrier layer. The light-emitting layer includes an oligomeric fluorene or a mixture of oligomeric fluorenes. The base sheet has a rectangular main panel which extends from the wearer’s lower front trunk between the legs of the wearer to immediately rearward of the genital area to cover the person’s genital area. Additional connector tabs at the ends of the transverse ribs are fitted into slots in the end closure sheets. The upper section further comprises a slot for the front strut to insert there through.