A package-ready light-sensitive integrated circuit and process for preparing a light-sensitive semiconductor substrate for packaging that provide for a reduced exposure of a light-sensitive integrated circuit to light. The series LEDs may be used to backlight an LCD in such applications as laptop computers, personal digital assistants, cellular telephones and automotive applications. The tension arm has a tension arm head with a tension arm leg extending longitudinally therefrom. The grab bar is on a side closer to the third seat portion in the width direction of the vehicle when viewed from the steering wheel. Adjusting the mixing speed and temperature of the epoxy base, the accelerator mixture, and the epoxy accelerator is contemplated to promote homogeneity. The system is one of a memory array and a logic system, and a circuit of the at least one circuit is one of a memory cell of the memory array, a sense amplifier of the memory array and a path of the logic system.