A communication partner appliance is implemented within a near field communication system. Advantageously, a short chain diol will be incorporated into the adhesive in order to enhance reactivity and strength build. The DDC design also can have a strong body effect compared to conventional bulk CMOS transistors, which can allow for significant dynamic control of power consumption in DDC transistors. A liquid-phase immersion method or a deposition method may be employed to fill the holes in the first solid material.