An optoelectronic apparatus includes an optoelectronic device, a mounting portion, a frame member surrounding a periphery of the mounting portion, and an optical component. During operation, the FL-APC system controls operation of the TL-APC system. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body. The twisted pair of conductors exiting the third opening then terminate within one or more slots defined by neighboring turrets.