An image sensor package includes an image sensor die having an active side and a backside, wherein an image sensor device region and a bond pad are provided on the active side. The tag reader determines which of the different locations is a preferable location for placing an RFID tag by detecting the transmission power level or other value required to communicate with the RFID tag at each of the different locations. Co-molded pre-forms can include hard surface layers over softer molded compositions. Based on the type of the selected symbol, the content of the bonus awarded to the player is determined. Control circuitry is coupled to the pixel array to control operation of the pixel array.