An underfill material for attaching and underfilling a semiconductor component on a substrate includes a polymer base material, and electrically conductive particles in the polymer base material. The inner unlatching mechanism includes a turnable inner unlatching rod on which a locking wheel is mounted to turn therewith. The heater attaches to the reservoir and has a heating element extending into the process. Full voltage is maintained to a remaining portion of the processor, so that the remaining portion of the processor can continue to operate while the instruction-processing portion of the processor is in reduced power mode.