A process is provided for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip to be mounted on a principal surface of the die pad and the semiconductor chip and die pad are sealed with a plastic mold. A scaled voltage value is determined by scaling the battery voltage measurement with respect to a start voltage andor predetermined end voltage. The gel coating, which is applied to one side of the fabric, is preferably silicone gel. To avoid problems caused by clusters of node forming and of loners being unable to join the cloud, network churn algorithms are taught. Enlargement andor zooming in of the map image taketakes place on the display device.