A method for opening a bond pad on a semiconductor device is provided. Terminals of the circuit board are connected to outside contact portions of conductive contacts which portions protrude from proximity to an upper end of a side surface of the casing. Parametric ultrasonic frequency input is supplied to the piezoelectric film to propagate multiple ultrasonic frequencies having a difference component corresponding to the desired subsonic, sonic or ultrasonic frequency range. Each of the switching elements includes a control electrode and a data electrode.