Embodiments of the present invention relate to the instantiation of a coding competition to address problems in program modules. A heating element is located adjacent the mirror pane for heating the pane to remove precipitation. A vertical row of bonding pad structures is located on each side of the semiconductor die while a third vertical row of bonding pad structures is located in the center of the semiconductor die. This bandgap reference voltage circuit can be used in battery powered units having reduced supply voltages as low as, for example, 1.