Methods of conducting wafer level burn-in of semiconductor devices are presented wherein systems are provided having at least two electrodes. In a method of producing a confectionery product, the confectionery mass is deposited as at least one strip having a width in the range of 5 to 500 mm andor thickness in the range of 0. A plating layer is formed on the lead bottom surface parts and the lead upper end parts. The lamps include at least one first lamp and a plurality of second lamps each having an irradiation area smaller than that of the first lamp.