A system and method of assembling a ball grid array package with IC die support is described. The cavity includes a retention device having a retention surface forming an obtuse angle with the cavity wall. This technology makes possible a variety of new resonator configurations, including disk resonators and lateral clamped-clamped and free-free flexural resonators, all with significant frequency and Q advantages over vertical resonators. According to this invention, the elements are interlinked by simple joining elements.