A method and related configuration for stacking and interconnecting multiple identical integrated circuit semiconductor die. An inorganic insulating film containing nitrogen, which is less likely to transmit moisture compared with an organic resin, is formed so as to cover a TFT. The invention further comprises using the original PIN as a seed number to create a true encryption key, using the true encryption key to encrypt an application secret data into a ciphertext and storing, in the memory, the ciphertext. The roll bars are interconnected by reinforcing elements that extend transverse to the longitudinal direction. The opposing force produced by the two magnets when the subject rests on the supporting structure reduces the compressive force acting on the tissues therebetween. In one embodiment, the fusion device includes a body portion, a first endplate, and a second endplate, the first and second endplates capable of being moved in a direction away from the body portion into an expanded configuration or capable of being moved towards the body portion into an unexpanded configuration.