1460421203-19d0dd02-8db0-40e4-a29a-77574ea888f7

A microelectronic structure, and in particular a semiconductor structure, includes a substrate and a dielectric layer located over the substrate. The barriers, consisting of a plurality of equally sized n-well regions formed within the p-substrate, are formed between the analog and digital portions and on at least one side of sensitive analog circuits. The flange pressing portion is provided on the cover, and when the cover is open, the flange pressing portion is moved toward the center of rotation of the cover, by means of a rotating member, a base member and a spring.