A conductive via of a semiconductor device includes a relatively small diameter portion extending into an active surface of a fabrication substrate and a corresponding, relatively large diameter portion that extends into a back side of the fabrication substrate. Certain of the catalysts are particularly effective at polymerizing ethylene and styrene into copolymers having novel properties, including a low molecular weight and close comparison between vinyl and methyl end groups. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. Third, the pulse is then passed through a gas medium, which can be inside a resonant cavity, to generate a high-order harmonic in the form of extreme ultraviolet radiation. The catalyst is prepared by a specific order of steps: crushing, calcining, acidic autoclaving, drying, further calcining and impregnation with catalytic metals.