A via structure having improved reliability and performance and methods of forming the same are provided. The method includes placing a sequence of read data words on the data bus and applying a data bus inversion signal on the data masking pin, the data bus inversion signal indicating whether the data contained each read data word has been inverted. The second device mimics the power state of the first device. The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system.