Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board. a position checking portion that checks the position of the clad film on the clad film shape retaining portion, and a first position adjusting portion that adjusts the position of the clad film shape retaining portion so that the clad film on the clad film shape retaining portion is disposed at a reference position while checking the position of the clad film with the position checking portion. The surface of the suction cup preferably has upstanding portions to engage the undersurface of the bracket to depress the suction cup assuredly upon downward movement of the bowl. Accordingly, embodiments may be used with respect to a post-paid metering model, a pre-paid metering model, and combinations thereof. The readout circuit is coupled to the pixel groups.