A mounting apparatus for a circuit board comprises a support plate, a tray and a clip. The device comprises: a supplementary roller, which is disposed between an outer rail and an inner rail of the track; an elastic member for biasing the supplementary roller toward the outer rail to roll thereon; and a supporting block to which the elastic member is fixed. The method further includes forming a pure metal on the alloy metal, and reflowing the pure metal such that the pure metal migrates to a bottom of the structure, while the alloy metal prevents exposure of the barrier layer. The lamination process joins the two sheets which are of different widths to allow the process to produce stock for different final products. The intermediary identifies a mapping aspect to invoke the target web service from the aspect library. The system also includes a controller in communication with the automated transport device for moving the automated transport device in an indexed manner.