There is provided an integrated electronic circuit. The nodes of a design are assigned initial labels. The surface of the silicon wafer is then bonded to the microelectromechanical system wafer in such a manner that the active areas of the chips on the microelectromechanical system wafer are corresponding to the cavities on the silicon wafer. The roll has internal channels having openings in opposed axial end faces of said roll which are communicative with the suction orifices.