An over-current and over-voltage protection assembly apparatus including an over-current protection device and an over-voltage protection device is provided. Specifically, a multi-chip package is coupled to an interposer to form the multi-chip module. Thus, it is possible to provide a light emitting semiconductor device, which has a low contact resistance and a sufficient bond strength to the InxAlyGa1-x-yN layer while maintaining the crystallinity of the InxAlyGa1-x-yN layer. The dust collecting electrode attracts the dust particles to the air exhaust nozzle, and the dust particles are exhausted to the external side of the drive with the air exhaust nozzle.