An electrical package with improved thermal management. The semiconductor device provides a way of preventing an electrical short between the conducting line pattern and a landing pad adjacent to the conducting line pattern. Each of the operative ends includes a substantially smooth and continuous surface thereon. Multiple hypotheses, each corresponding to a different set of a-prior bit values may be evaluated, with the decoded data for a hypothesis selected based on the evaluation output for further processing. The second die corrects a level of an output voltage in response to a feedback reference voltage applied from the first output pad to the second input pad.