A multi-chip BGA package has two or more rerouted chips, each of which has one or more electrode plates. The display frame can be comprised of a series of elements covered in a mesh like material or can be comprised of a shell like molded material. A service program may be downloaded to the local computer system that enables diagnostic interaction with the device by the remote computer system. A thermal conduction member is configured to thermally couple the central portion of the mounting substrate to the housing, so as to provide a second thermal conduction path that is different from the first thermal conduction path, for at least some heat generated by the solid state light emitting elements. The resin-supplemented emulsion may be contacted with carbon dioxide to form an initial mixture having an emulsified oil phase and an emulsified aqueous phase.