A semiconductor device 1 includes a semiconductor chip 10, a semiconductor chip 20 and a seal ring 30. The drain inset apparatus comprises a horizontal floor area having at least one drain hole positioned substantially on a center portion thereof. 8 moles, based on the molar amount of transition metal in the halo-bridged dimer of an added salt and of from 0 to 10 vol %, based on the total volume of the solvent mixture, of a solubilisation agent increasing the solubility of the halo-bridged dimer in the reaction mixture. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. Thus, electrodeposition forms a unique discrete interface at the molecular layer between the reinforcement and the matrix over as opposed to any previous resin infusion process. Through the plurality of needle heads disposed around the closed end of the glue storage cylinder portion, the glue drips on the periphery of the lens module evenly.