The present invention relates to an adhesive-backed tape for semiconductors which is characterized in that it is composed of a laminate of an insulating film layer having the following characteristics and and at least one adhesive agent layer in the semi-cured state. One or more intermediate metal bridging members isare first welded to a metal tube using a relatively rapid welding process that reduces heat input and residual tensile stress imparted to the tube. The map state storing unit stores therein a creation state indicating that creation of the map is in process or completed in association with the map. This function is accomplished using any suitable computer equipment capable of monitoring desired manufacturing conditions and using this data to calculate the optimum location for a splice.