Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. The communication system may include a plurality of downlink communication paths, at least two of the plurality of downlink communication paths may use different communication protocols, and at least one of the plurality of downlink communication paths may include the DVB-H downlink communication path. The open operating system is configured to receive a request for the protected data from one of a plurality of user applications and transfer the request to the RF operating system.