Embodiments of the present invention relate to a system including a first buffer and a second buffer. A cutting device has a blade movable in a slot of an anvil to shear on one side and to bend on the other side to form a crimped end portion. Then, a protective film is formed atop each of the sensing parts by depositing a SiO2 membrane over the glass wafer, exposing the SiO2 membrane to light, and etching the SiO2 membrane in the same pattern as in the sensing part.