A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The armrest assembly includes an angle-adjustment mechanism that allows the armrest to pivot and to translate forward, and a lift mechanism that enables vertical articulation of the armrest. In the liquid discharge device, the narrow section functions to damp micro vibration that occurs in liquid in the communication path, and this allows liquid drops having a pre-designed volume and flying speed to be discharged from every nozzle on a board . A wire is fed through the axially extending passage and melted as it exits the axially extending passage. On both sides of the upper surface of the rigid material rectangular body, respective internal and external semicircular moldings are located as housings for the rigid material tubular handles of the saddlebags, and for the rigid material tubes located on the lower surface of the upper rectangular bag.