A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. This feature allows the discharging process of the CMOS memory to be carried out more conveniently and efficiently. , R5 and R6 each represent \u2014X5\u2014X6\u2014X7, and Ar represents phenyl, pyridyl, etc.