Embodiments of the present invention are directed to high density arrays of optical transceiver modules. This method is particularly suitable for the patterned deposition of polymers and small organic molecules in organic light emitting diodes and organic transistors. Such input is examined such that a device may ignore unintentional and resting contact while reacting only to purposeful contact. Material is removed from the microfeature workpiece and at least a portion of the polishing liquid is passed through at least one recess in the polishing surface so that a gap in the polishing liquid is located between the microfeature workpiece and the surface of the recess facing toward the microfeature workpiece. A prosthetic template is placed over the second intermediate component. Either the output shaft detachably couples shaft, shaft detachably couples shaft, or shaft detachably couples shaft.