Foamable compositions which exhibit reduced surface tack and better handling characteristics are obtained through the use of specific combinations of epoxy resins. The drive mechanism has a motor device, a transmission case, and a drive shaft connected to the motor device. The first semiconductor chip has, in its active surface, a wiring for connecting the second semiconductor chip and the third semiconductor chip, and a terminal for external connection on its surface opposite to its active surface. The endplate is at least partly made of fibreglass. A coexistence scheme is provided that is active in the MAC layer of a Wireless LAN device, aiming to make optimal use of the non-occupied BT slots for both uplink and downlink WLAN communication. The extruded billet can then be forged or processed by other conventional techniques to form end use products such as sputtering targets.