A new and improved substrate holder assembly for supporting a substrate in a process chamber for the fabrication of semiconductor integrated circuits on the substrate. The blow molded plastic structure has a first surface and a second surface extending between a first end and a second end and forming a chamber there between. Since the glass body 18 to be crushed does not come into contact with crushing means, for example rollers or the like, the pieces of broken glass 22 cannot be contaminated by abrasion particles of the crushing means. The base has a bottom surface and is configured and arranged to be securely mounted to a surface. A destination terminal is configured to demodulate the header using the default modulation scheme and the default coding scheme, and to examine the header to determine a particular coding scheme and a particular modulation scheme associated with the payload. A coupler is attached to an upper end of the legs for selectively coupling the legs to a vertical surface.