Disclosed is a thin film transistor substrate and a system for inspecting the same. At or prior to maturity of the exchangeable security, a holder of the exchangeable security may exchange a share of the exchangeable security for a share of the underlying security or basket of underlying securities. The package further includes first electrical connections contacting the first side of the first IC die, and second electrical connections contacting the second side of the first IC die. The downward slope of the process tunnel enables gravity to drive the floatingly supported substrates through the successive segments, causing the atomic layer deposition of a film onto the substrates. With this structure, only regular parts shifted into a specific posture are guided to an alignment and feed guide 14 and irregular parts are stored in an irregular parts storing part 16.