An apparatus includes a housing having a first side and a second side, and a plurality of Registered Jack plugs attached to the first side. An interposer substrate is formed with interconnections in the form of conductive bumps on both a first surface and a second surface to provide a respective first level interconnect and a second level interconnect for a semiconductor die to be mounted to the interposer substrate. A rate of fouling may be established by monitoring the density of the fill portion of the cooling tower over time. A contact module could also be provided to readwrite an S-card.