A polymerization process is provided. When either one of the metallic guide plates is inserted into the respective insertion slot, the metallic guide plate is electrically connected to the respective line of the telephone cord. On the other hand, in the program region, because at least one of the track pitch and linear speed is slower than in the standard case, the recording capacity of the program region can be increased. Embodiments of a method of forming an integrated circuit include forming a trench in a silicon wafer.