Methods for fabricating microelectronic interconnection structures as well as the structures formed by the methods are disclosed which improve the manufacturing throughput for assembling flip chip semiconductor devices. In this method, an optical signal is supplied to an optical waveguide structure for providing a nonlinear effect. According to the present invention, it is able to reduce power consumption during the transmission of special burst data. Alternatively, photolithographic processes can provide the required positional accuracy for fiducials on the assembly andor the optical element. in the presence of a dispersing auxiliary and of a free-radical polymerization initiator such that at least 85% by weight of the polymer is formed from these monomers.