A wafer processing system employing a single-wafer load lock with integrated cooling unit is disclosed. Each half-width type machine case has one side plate provided with at least one positioning member protruding outward and another opposite side plate bored with receiving holes at the locations respectively corresponding with the positioning members. The method further involves processing the subset of fields in an instance of the XML document that are designated by placeholders in XML document template object. If repair is not possible and replacement of the damaged portion is not available or desirable, the packet is discarded. A treatment member is insertable into the interior space of the body member.