The present disclosure provides a method for forming patterns in a semiconductor device. In order to facilitate fastening and removing body parts in combination with a gasket profile, there is located on said head an engagement surface for an assembly tool and at least one holding element, such as a recess to which a component, optimally a gasket profile, particularly of a door of a motor vehicle, is clasp-attached in a detachable manner. The panel has a peripheral frame, a plurality of dam bars disposed within the peripheral frame, a plurality of leads extending transversely from portions of the plurality of dam bars and a plurality of support bars extending transversely from other portions of the plurality of dam bars.