A heat dissipating structure for a computer host is disclosed. Large area electrodes are equipped on the packaging enclosure and the packaging cover is made of transparent silicon gel so that the bonding die can emit larger light energy and higher luminance via the packaging cover while the heat produced by the chips can be quickly dissipated by the electrodes. A horizontal barrier rib is provided between the vertical barrier ribs to separate the red, green and blue discharge cells from each other in a wide direction. The network interfaces may include facilities to manage data transfer between computer nodes.