The invention is a sealing system, such as a packer, that is used in a wellbore to seal against an exterior surface, such as a casing or open wellbore. A first electrical conductor for carrying a current to be sensed is attached to one face of a piezoelectric element. The semiconductor device also includes a contact hole formed at a crossing portion of the lower conductive layer and the upper conductive layer. The product parameters specify features of a component. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided. A numerical aperture of the objective lens, consequently, can be increased, high density information recording and information reproduction can be performed, and further, an optical pickup apparatus and an information recording andor reproducing apparatus each having compatibility are realized.